antimony  Sb
Available form
Lump/powder/stick
Application field

 

 

 
Application Field
Antimony blocks, antimony particles, antimony rods
 
1. Technical docking: antimony trichloride SbCl3 -- rectification -- via hydrogen reduction -- antimony block -- pelleting under oxygen protection;
 
2. Physical properties:
 
Atomic weight: 121.760
 
Electronegativity: 2.05
 
Density: 6.697 g/cm3 (25 ℃)
 
Melting point: 630.63 ℃
 
Boiling point: 1587 ℃
 
3. Physical properties: powder, block, ingot, bar, single crystal;
 
4. Purpose:
 
Is mainly used for the preparation of Ⅲ - Ⅴ compound semiconductor InSb, BiSb, GaSb, high purity alloy, electronic refrigeration components materials and germanium, heavily sb-doped silicon doping agent;
 

Product description
Describe
Antimony blocks, antimony particles, antimony rods
1. Technical docking: antimony trichloride SbCl3 -- rectification -- via hydrogen reduction -- antimony block -- pelleting under oxygen protection;
2. Test: icp-ms (the total impurity content of 5N antimony is lower than 10ppm);
3. Service: provide free samples, MSDS and practical protective measures, and solutions of applied materials;
4. Physical properties:
Atomic weight: 121.760
Electronegativity: 2.05
Density: 6.697 g/cm3 (25 ℃)
Melting point: 630.63 ℃
Boiling point: 1587 ℃
5. Specifications:
Chemical purity:
High purity: Sb-05 purity 99.999% above, silver, arsenic, bismuth, cadmium, copper, iron, magnesium, manganese, silicon, nickel, lead, sulfur, zinc impurity total content less than 10ppm;
Ultra pure antimony: sb-06 purity 99.9999% above, silver, arsenic, bismuth, cadmium, copper, iron, magnesium, manganese, silicon, nickel, lead, zinc impurity total content less than 1ppm;
Ultra high purity antimony: sb-07 purity 99.99999% above, silver, arsenic, bismuth, cadmium, copper, iron, magnesium, manganese, silicon, nickel, lead, zinc impurity total content less than 0.1 PPM.
6. Physical properties: powder, block, ingot, bar, single crystal;
7. Purpose:
Is mainly used for the preparation of Ⅲ - Ⅴ compound semiconductor InSb, BiSb, GaSb, high purity alloy, electronic refrigeration components materials and germanium, heavily sb-doped silicon doping agent;
8. Packaging: three-layer vacuum packaging or argon filled protection;
Other materials
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